JDB电子

A History Of Innovation

For more than 55 years, JDB电子 has served the polyolefins industry with a team dedicated to die development and solely focused on manufacturing pelletizing die plates.?As one of the world’s largest aftermarket die plate manufacturers, we offer solutions that fit all major OEM pelletizers. Our experience has led to the development of numerous design innovations that greatly increase the standard of performance for pelletizing die plates.

  • 1964 -?JDB电子 produces our first Underwater Pelletizing Plate.
  • 1965 -?JDB电子 patents the Tungsten Carbide Tile Face, enabling us to braze sintered tungsten carbide onto dies.
  • 1969 -?JDB电子 debuts its Contoured Heat Channel design that maximizes available space and locates the channels closer?to the polymer.
  • 1972 -?JDB电子 innovates Low-Pressure Slotting, which reduces overall pressure drop across the die.
  • 1982 -?JDB电子 patents its design for Internal Insulation, which maximizes heat at the tip of the orifice.
  • 1986 -?JDB电子 patents its design for Next?Gen Internal Insulation, improving upon its 1982 patent.
  • 2000 -?JDB电子 patents the Sintered Titanium Carbide?Cutting Face that maximizes the die’s thermal performance and enables an underwater start-up for polyethylene.
  • 2015 -?JDB电子 innovates Low-FrictionPolymer Flow Paths that help minimize melt fracture in LLDPE and additive build-up in PP.
  • 2016 -?JDB电子 patents its TrueTherm? safety feature that improves upon the center gasket design.
  • 2018 -?JDB电子 debuts its FerroTiC Segmented Cutting Faces, which allow for more orifice holes in a given geometry.

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Innovative Technology

Our pelletizing die plates are known throughout the polyolefins industry for their?superior design, safety features, and low total cost of ownership. Learn more about what makes them better.

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